T113S3 Embedded Board
Cost-optimised dual-core Cortex-A7 embedded board with in-package DDR3, RGB/LVDS output and a 7-year Linux BSP.
Integrated smart-display SoC with on-chip TCON — one board drives the panel, the touch and the application logic.
Evaluation units ship in 5 working days. Customised variants quoted within 3 working days of receiving your requirement.
The SSD2381 board is built around a smart-display SoC that integrates the timing controller, a 2D graphics accelerator and the frame buffer on-die. That removes the separate TCON board and the bridge IC that usually sit between an application processor and an industrial panel.
Fewer components means a shorter bill of materials, a smaller board and — in practice — noticeably better EMC behaviour, because the highest-frequency display signalling never leaves the package.
It is our recommended platform for 7" to 10.1" operator terminals that need a polished animated UI, fast boot and industrial connectivity, but do not need neural inference.
Drives MIPI-DSI, single-channel LVDS or parallel RGB panels directly. No external TCON, no bridge IC, no extra BOM line.
Alpha blending, rotation and scaling in hardware keep a 60 fps animated interface smooth while the CPU stays free for protocol handling.
A staged boot image paints the UI splash from the co-processor while Linux continues to start — perceived boot time under one second.
Two isolated-ready RS485 channels, CAN 2.0B, 10/100 Ethernet and 8 opto-isolatable GPIO on a pluggable terminal block.
Pre-validated timing profiles for more than 60 industrial TFT panels from AUO, BOE, Innolux, Tianma and Sharp.
Component placement and keep-outs designed for automated conformal coating in humid or corrosive installations.
Standard configuration shown. Memory, storage, interface population, operating temperature grade and board outline can all be changed for OEM builds.
| Processor | SigmaStar SSD2381, dual-core Arm Cortex-A7 @ 1.2 GHz with integrated display subsystem |
|---|---|
| Graphics | Hardware 2D engine: alpha blending, rotation, scaling; on-chip frame buffer |
| Memory | 128 MB / 256 MB DDR3 (in-package) |
| Storage | 8 GB eMMC standard, up to 32 GB; SPI NOR boot flash |
| Display output | MIPI-DSI 4-lane, single-channel LVDS, parallel RGB888 - up to 1280 x 800 @ 60 Hz |
| Touch | I2C PCAP controller interface with glove and wet-finger tuning profiles |
| Ethernet | 1 x 10/100 Mbps |
| Serial / fieldbus | 2 x RS485 (isolation-ready), 2 x RS232/TTL UART, 1 x CAN 2.0B, I2C, SPI |
| Digital I/O | 8 x GPIO on pluggable terminal block, opto-isolation option |
| USB | 1 x USB 2.0 host, 1 x USB 2.0 OTG (service port) |
| Audio | I2S codec, 3 W mono amplifier, buzzer driver |
| Operating system | Linux 4.9 / 5.10 BSP with Qt 5.15, LVGL 9 and Slint reference builds |
| Power | 9-36 V DC wide input with reverse-polarity and surge protection, 3.2 W typical |
| Operating temperature | -20 C to +70 C standard, -40 C to +85 C on request |
| Dimensions | 100 x 75 mm, 4 x M3 mounting holes |
| Compliance | CE, FCC, RoHS 3; EN 61000-6-2 / 6-4 industrial EMC pre-tested |
Need the full datasheet, 3D STEP model or a test report? Request them with your quote and we will send them the same day.
Cost-optimised dual-core Cortex-A7 embedded board with in-package DDR3, RGB/LVDS output and a 7-year Linux BSP.
Quad Cortex-A55 embedded board with an on-chip NPU and dual camera inputs — interface and inference on one board.
Quad Cortex-A55 industrial board with dual Gigabit Ethernet, dual CAN-FD and a 10-year supply commitment.
Every platform on this site started as a customer-specific design. Ours is a customisation business that happens to keep a standard catalogue.
Board shape, connector type and orientation matched to your existing harness and enclosure.
Galvanic isolation on RS485, CAN and digital I/O for installations with long cable runs.
9-36 V or 18-75 V input variants with EN 61000-4-5 surge immunity.
Our Qt/LVGL engineering team can deliver the complete operator interface, not just the hardware.
Pilot runs from 50 pcs with full AOI and ICT so you can validate before committing to volume.
Send the panel size, interface list, temperature range and target volume. You will get a configuration, a price and a lead time — from an engineer, within one business day.
Your message goes directly to the application engineer responsible for this platform.